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Keywords: Delphi, vias
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031013.
Published Online: September 30, 2011
... circuit interconnections printed circuits compact thermal, model Delphi, vias micro-vias genetic algorithms In 1996, the component-level thermal design was revolutionized by compact thermal model [( 1 )] capabilities, which were promoted by an European project, named DELPHI...
