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Keywords: Dielectrics
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031003.
Paper No: EP-17-1081
Published Online: May 11, 2018
... 31, 2018; published online May 11, 2018. Assoc. Editor: Baris Dogruoz. 14 09 2017 31 01 2018 3D packaging Dielectrics Microsystems Power packaging Solder Thermal analysis The rapid increase in heat dissipation of next-generation integrated circuits necessitates...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031006.
Paper No: EP-17-1016
Published Online: June 30, 2017
... resins, and bisphenol A epoxy resin (DGEBA) was used as a control. The chemical structures of the synthesized resins were characterized by nuclear magnetic resonance ( 1 H-NMR). Properties of the cured epoxy resins were investigated by dielectric test, differential scanning calorimetry (DSC...
Journal Articles
Vana Snigdha Tummala, Ahsan Mian, Nowrin H. Chamok, Dhruva Poduval, Mohammod Ali, Jallisa Clifford, Prasun Majumdar
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020904.
Paper No: EP-16-1137
Published Online: June 12, 2017
...-dimensional (3D)-printed porous microstructure on the dielectric characteristics for radio frequency (RF) antenna applications. In this study, a sandwich construction made of a porous acrylonitrile butadiene styrene (ABS) thermoplastic core between two solid face sheets has been investigated. The porosity...
Journal Articles
Santosh Sankarasubramanian, Jaime Cruz, Kyle Yazzie, Vaasavi Sundar, Vijay Subramanian, Tsgereda Alazar, Sivakumar Yagnamurthy, Edvin Cetegen, David McCoy, Pramod Malatkar
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020902.
Paper No: EP-16-1149
Published Online: April 24, 2017
... such as epoxy mold compounds and stiffeners, attached to the package [ 1 – 3 ]. Dielectrics Electronic Flip chip Harsh environment Polyimide Reliability Underfill 27 12 2016 24 03 2017 Contributed by the Electronic and Photonic Packaging Division of ASME for publication...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041007.
Paper No: EP-16-1051
Published Online: October 20, 2016
... 19, 2016; final manuscript received September 27, 2016; published online October 20, 2016. Assoc. Editor: Ashish Gupta. 19 03 2016 27 09 2016 Dielectrics Thermal analysis Liquid immersion cooling is gaining a stronger foothold in the industry as an accepted thermal...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2016, 138(2): 020802.
Paper No: EP-16-1018
Published Online: April 19, 2016
...Erdal Uzunlar; Jared Schwartz; Oluwadamilola Phillips; Paul A. Kohl Polymers can be used as temporary place holders in the fabrication of embedded air gaps in a variety of electronic devices. Embedded air cavities can provide the lowest dielectric constant and loss for electrical insulation...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041006.
Paper No: EP-14-1089
Published Online: October 15, 2015
... mm 2 chip is expected to generate local temperature gradients. In addition, bonding failures at manufacturing or during operation (cracks, delamination, etc.) may also lead to local hot spots. Therefore, possible hot spots over an LED chip have turned attention to direct cooling with dielectric...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031002.
Paper No: EP-12-1085
Published Online: May 5, 2014
... micrographs reveal the extent of filler dispersion. The dielectric properties at 1 MHz and 5 GHz have been investigated as a function of filler content. The relative permittivity increases with filler loading, maintaining a low dielectric loss. The composite with highest filler loading of 0.4 volume fraction...
