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Keywords: Dynamics
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 200–207.
Published Online: July 17, 2004
...E. H. Wong The dynamic response of the printed circuit board (PCB) in a standard board-level drop impact test has been modeled as a spring-mass system, a beam, and a plate. Analytical solutions for the time-response and amplification of the deflection, bending moment, and acceleration at any point...
