... packaging Chip stacking Electrical design Flip chip Micro vias Reliability Thermal analysis Through-silicon via (TSV)-based three-dimensional (3D) integration presents a path toward reduced delay, reduced power consumption, higher performance, smaller packaging size, and heterogeneous...

... received December 22, 2017; published online May 9, 2018. Assoc. Editor: Kaushik Mysore. 12 10 2017 22 12 2017 DCA Electrical design Flexible circuits Roll to Roll Manufacturing Sensors The widespread deployment of advanced sensors in the buildings sector has the potential...

... online June 12, 2017. Assoc. Editor: S. Ravi Annapragada. 14 12 2016 30 03 2017 3D packaging Electrical design Physics of failure Reliability Managing the effects of mechanical stress in silicon chips is a growing challenge—both in order to optimize the device performance...

... Gupta. 04 01 2016 13 04 2016 Electrical design Thermal analysis By January 2014, 42% of adult Americans owned a tablet computer [ 1 ]. It has been reported that tablet computer surface temperature can rise up to 47 °C when used in a warm room [ 2 , 3 ]. When the skin...

... March 18, 2016; published online April 19, 2016. Assoc. Editor: Mehmet Arik. 19 02 2016 18 03 2016 Algorithms Coupled codes Design methodology Electrical design Heat transfer PWB PWB Design Thermal systems Numerical Integration methods Metal wiring in PCBs carries...

.... annealing CNT conductive silver ink direct write electrical design flexible circuits graphene inkjet-printed electronics low temperature bonding paper-based electronics microwave organic electronics sensors SOP The current era of passive RF electronic circuits depends heavily...