...Richard C. Jaeger; Jeffrey C. Suhling; Jun Chen The conjecture discussed in our previous paper [Jaeger, R. C., Motalab, M., Hussain, S., and Suhling, J. C., 2014, “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors,” ASME J. Electron. Packag., 136 (4), p. 041014; Jaeger, R. C...

...Ž. Staliulionis; H. Conseil-Gudla; S. Mohanty; M. Jabbari; R. Ambat; J. H. Hattel The aim of this paper is to model moisture ingress into a closed electronic enclosure under isothermal and non-isothermal conditions. As a consequence, an in-house code for moisture transport is developed using...

... Corporation, 1 Space Park, Redondo Beach, CA 90278. Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received January 9, 2018; final manuscript received April 12, 2018; published online May 9, 2018. Assoc. Editor...

... joint. The Auger electron spectroscopy (AES) surface and depth profile techniques identified surface and through-thickness contaminants in the Au metallization layer. In one case, the AES analysis identified background levels of carbon (C) contamination on the surface; however, the depth profile...

... also observed such as the leakage power and the fans' speed change. Finally, possible remedies are proposed to reduce the probability and the consequences of the cooling system failure. 1 Corresponding author. Contributed by the Electronic and Photonic Packaging Division of ASME...

...Sandeep Mallampati; Liang Yin; David Shaddock; Harry Schoeller; Junghyun Cho Predominant high melting point solders for high-temperature and harsh environment electronics (operating temperatures from 200 to 250 °C) are Pb-based systems, which are being subjected to RoHS regulations because...

...Nicolas Lamaison; Raffaele L. Amalfi; Todd Salamon; Jackson B. Marcinichen; John R. Thome Gravity-driven two-phase liquid cooling systems using flow boiling within microscale evaporators are becoming a game-changing solution for electronics cooling. The optimization of the system's filling ratio...

...Sven Rzepka; Alexander Otto; Dietmar Vogel; Rainer Dudek The revolutionary changes in automotive industry toward fully connected automated electrical vehicles necessitate developments in automotive electronics at unprecedented speed. Signal, control, and power electronics will heterogeneously...

...Richard C. Jaeger; Mohammad Motalab; Safina Hussain; Jeffrey C. Suhling 16 10 2017 11 12 2017 Electronic Sensors Fig. 1 Analysis by superposition: ( a ) diagonal current excitation; ( b ) and ( c ) equivalent circuits for superposition Unfortunately...

...Ercan M. Dede; Feng Zhou; Paul Schmalenberg; Tsuyoshi Nomura Rapid advancement of modern electronics has pushed the limits of traditional thermal management techniques. Novel approaches to the manipulation of the flow of heat in electronic systems have potential to open new design spaces. Here...

... without overcooling the entire data center. Dynamic local cooling can be achieved by placing actuators to control cooling air delivery as close to the IT equipment as possible. Electronic Failure analysis Thermal analysis 18 09 2017 29 11 2017 Contributed by the Electronic...

... Developments in Thermal Management in Data Centers ,” ASME J. Electron. Packag. , 137 (4), p. 040801. 10.1115/1.4031326 [3] Strike , N. D. , 2015, “Fan Efficiency, an Increasingly Important Selection Criteria,” NMB Technologies Corporation, Tempe, AZ, accessed Jan. 21, 2015 , http://www.nmbtc.com...

...% or a corresponding power consumption of 322 TWh [ 3 ]. With this industry continuing to grow and strain the national electricity grid, there is a need to target energy savings within the data center. Electronic Thermal analysis 19 02 2017 21 09 2017 Contributed by the Electronic...

... properties such as viscosity. Direct immersion of electronic equipment offers a singular cooling solution in which the entirety of a server may be cooled by a single medium. This may provide simplicity and ease in planning and implementation of a total solution. A legacy approach to full liquid immersion...

...Rajiv L. Iyer; Daryl L. Santos Over the past ten years, there has been an exponential growth in innovations and designs to offer cutting edge electronic devices that are smaller, faster, with advanced features built in. The existence of smartphones, wearable devices, tablets, etc., is the evidence...

.... The heat transfer coefficient in the subcooled region reaches a maximum value of about 12 kW/m 2 K, whilst in two-phase flow it goes up to 30 kW/m 2 K. Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript...

...Kaysar Rahim; Ahsan Mian The packaging of electronic and microelectromechanical systems (MEMS) devices is an important part of the overall manufacturing process as it ensures mechanical robustness as well as required electrical/electromechanical functionalities. The packaging integration process...

...Yuyan Gao; Huanyu Cheng Specific function or application in electronics often requires assembly of heterogeneous materials in a single system. Schemes to achieve such goals are of critical importance for applications ranging from the study in basic cell biology to multifunctional electronics...

... at temperatures up to 260 °C, which is the typical maximum temperature experienced by electronic packages during solder reflow. For the epoxy underfills tested in this study, the DCB samples failed cohesively within the underfill at room temperature but started failing adhesively at temperatures near 150 °C...

... energy by allowing IT equipment to operate outside the currently recommended and allowable ASHRAE envelopes and outside the ISA severity level G1. 1 Corresponding author. Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P...