... ACKAGING . Manuscript received May 29, 2018; final manuscript received July 19, 2018; published online September 10, 2018. Assoc. Editor: Satish Chaparala. 29 05 2018 19 07 2018 Flexible circuits Roll to Roll Manufacturing The growing demand for low-cost, miniaturized, low...

... received June 3, 2018; published online July 2, 2018. Assoc. Editor: Satish Chaparala. 22 10 2017 03 06 2018 Flexible circuits Power packaging Reliability Wirebond Silicon carbide (SiC) semiconductor devices allow power electronics to operate at high voltages (>10 kV...

... Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received June 7, 2017; final manuscript received March 27, 2018; published online May 11, 2018. Assoc. Editor: Kaustubh Nagarkar. 07 06 2017 27 03 2018 Battery technology Flexible...

... received December 22, 2017; published online May 9, 2018. Assoc. Editor: Kaushik Mysore. 12 10 2017 22 12 2017 DCA Electrical design Flexible circuits Roll to Roll Manufacturing Sensors The widespread deployment of advanced sensors in the buildings sector has the potential...

... OF E LECTRONIC P ACKAGING . Manuscript received December 25, 2016; final manuscript received February 28, 2017; published online June 14, 2017. Assoc. Editor: Satish Chaparala. 25 12 2016 28 02 2017 3D packaging CSP Electronic Flexible circuits MEMS Micro vias PWB...

... December 1, 2016; final manuscript received February 22, 2017; published online June 13, 2017. Assoc. Editor: Xiaobing Luo. 01 12 2016 22 02 2017 Composite materials Electronic Flexible circuits Nanotechnolgy Given the rapid recent development in heterogeneous integration...

... June 12, 2017. Assoc. Editor: Justin A. Weibel. 16 12 2016 28 03 2017 Flexible circuits FR-4 Harsh environment Reliability Thermal analysis With a quadruple increase of optical enhancement in late 1990s creating new application opportunities, light emitting diodes (LEDs...

...Justin A. Weibel; S. Ravi Annapragada 22 03 2017 31 03 2017 3D packaging Backplanes Chip stacking Failure analysis Flexible circuits Nanotechnolgy Reliability Solder Thermal analysis Underfill Wafer level packaging ASME's International Mechanical Engineering...

... Annapragada. 26 12 2016 03 04 2017 Failure analysis Flexible circuits Reliability Stretchable electronics have a variety of possible applications and use conditions [ 1 – 8 ]. These applications will experience different mechanical boundary conditions in regards to mechanical...

... of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received August 30, 2016; final manuscript received November 13, 2016; published online December 7, 2016. Assoc. Editor: Xiaobing Luo. 30 08 2016 13 11 2016 Flexible circuits FR-4 Polyimide Power...

... online July 21, 2016. Editor: Y. C. Lee. 27 12 2014 29 06 2016 Conductive Inks Direct write Flexible circuits Radio-frequency identification is the use of a wireless noncontact system for automatic identification and tracking [ 1 – 3 ]. A typical RFID system mainly contains...

... performance ever achieved on multilayer organic substrates. Flexible circuits Organic electronics Power packaging SOP Thermal analysis System packaging plays a key role in modern electronic devices. Packaging technologies have evolved with time to solve the growing challenges of electronic...

... back to the evaporator as shown in Fig. 1 [ 1 ]. 3D packaging Flexible circuits MEMS Microsystems Nanotechnolgy Thermal analysis Wafer level packaging 04 08 2014 10 10 2014 Contributed by the Electronic and Photonic Packaging Division of ASME for publication...

.... annealing CNT conductive silver ink direct write electrical design flexible circuits graphene inkjet-printed electronics low temperature bonding paper-based electronics microwave organic electronics sensors SOP The current era of passive RF electronic circuits depends heavily...