.... Also, it can be concluded that the temperature gradient induced by Joule heating plays a more important role than electron wind in the atomic migration of the printed silver wire subjected to a high current density. The influence of the printed silver wire size on the EM behavior was also analyzed...

... of China 10.13039/501100001809 51975594 National Natural Science Foundation of China 10.13039/501100001809 U20A6004 microelectronics packaging flip chip reliability electric-thermal-force multi-field coupling high current density thermal interface material 11 07 2021 13...

... distribution, thermal stress, and deformation of the flip chip under high current density were analyzed. At the same time, the influence of thermal interface material's thermal conductivity and operating current on flip chip reliability was studied. The result showed that when the thermal interface material...

... not observe any damage in the solder joint during PDC stressing when very high current density was applied may be due to the low duty factor (0.96%) of PDC. On the other hand, high peak current of PDC generates a lot of heat in the Al trace which leads to its failure when 10 A PDC was applied...