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Keywords: LED lamps
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 328–338.
Published Online: April 9, 2007
... slugs have also been utilized to spread heat within the package. The number and thicknesses of interfaces between the die and heat sink were minimized. These changes have resulted in packages with thermal resistances on the order of 5– 15 K ∕ W . 14 06 2006 09 04 2007 LED...