... different from the experimental results. Several needed improvements to the electron-mobility model are proposed in this article. 06 04 2009 26 09 2009 04 03 2010 04 03 2010 conduction bands electron mobility internal stresses MOSFET moulding semiconductor device models...

... for the heat sinks from experimental data. 13 03 2006 13 02 2007 heat sinks MOSFET thermal management (packaging) The growth in power electronic component technologies has produced smaller-sized devices with increased capabilities for rapidly switching high levels of current...