... in conducting heat to the heatsink [ 4 – 6 ]. Composite materials Conductive adhesives Harsh environment Nanotechnolgy Reliability Thermal analysis 15 10 2017 09 04 2018 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E...

... environment MEMS Microsystems Nanotechnolgy PWB Reliability SMT The ever increasing portability, miniaturization, and functionality of consumer electronic products have driven the move to thinner printed wiring assemblies (PWAs) and smaller clearances between adjacent components. Accidental drop...

... December 1, 2016; final manuscript received February 22, 2017; published online June 13, 2017. Assoc. Editor: Xiaobing Luo. 01 12 2016 22 02 2017 Composite materials Electronic Flexible circuits Nanotechnolgy Given the rapid recent development in heterogeneous integration...

...Justin A. Weibel; S. Ravi Annapragada 22 03 2017 31 03 2017 3D packaging Backplanes Chip stacking Failure analysis Flexible circuits Nanotechnolgy Reliability Solder Thermal analysis Underfill Wafer level packaging ASME's International Mechanical Engineering...

...; published online October 21, 2016. Assoc. Editor: Ashish Gupta. 25 07 2016 06 10 2016 3D packaging Chip stacking Composite materials Nanotechnolgy Reliability Thermal analysis Underfill Vertical integration of integrated circuits (ICs) is a key driver in orthogonal system...

...K. S. Siow; Y. T. Lin The corresponding author is K. S. Siow. Nanotechnolgy Power packaging Solder 25 04 2016 13 05 2016 Copyright © 2016 by ASME 2016 1043-7398/2016/138(3)/037001/1/ $25.00 ...

... was developed in-house by Siemens Microelectronics in 1987 to bond large area power thyristors on molybdenum substrates [ 6 ]. Their initial formulation of sintered Ag pastes consisted only of micron-sized Ag flakes and cyclohexanol [ 6 ]. Conductive adhesives Nanotechnolgy Power packaging Solder...

...: Toru Ikeda. 20 09 2015 25 11 2015 Nanotechnolgy Thermal analysis Among all the phase change phenomena, boiling of thin liquid films has been a popular topic of research because of its practical applications in advanced micro- or nano-electromechanical systems...

... Microsystems Nanotechnolgy PWB Reliability SMT Impact loading is commonly seen in portable devices due to accidental drops. Relevant shock accelerations can reach up to tens of thousands of g's (“g” is the gravitational acceleration) [ 1 – 5 ], especially in the presence of secondary impacts...

.... 3D packaging Conductive adhesives Nanotechnolgy 01 07 2015 11 09 2015 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received July 1, 2015; final manuscript received September 11...

..., thermal stability after prolonged exposure to a high-temperature environment and thermal cycling tests shows limited deterioration for an array anchored using a silver-loaded thermal conductive adhesive (TCA). Nanotechnolgy Thermal analysis Many modern electronic components have a driving...

... back to the evaporator as shown in Fig. 1 [ 1 ]. 3D packaging Flexible circuits MEMS Microsystems Nanotechnolgy Thermal analysis Wafer level packaging 04 08 2014 10 10 2014 Contributed by the Electronic and Photonic Packaging Division of ASME for publication...