... enable the characterization of periodic stress and strain changes in the electrode materials of Lithium-ion batteries during the charge and discharge process. These ultrathin sensors are built on a polyimide substrate which can enable direct integration between cells without compromising safety or cell...

... than the adhesion to DP1. Microelectronic packages use materials such as silicon nitride, silicon oxide, and polyimide different as die passivation materials. As can be seen from Fig. 1 , the die passivation comes into contact with the underfill that is dispensed in between the copper-solder...

... with electronics. This work describes a flexible TGP (FTGP) fabricated using printed circuit board (PCB) technology, in which commercially available copper-cladded polyimide sheets are used as the casing material. The wick is composed of three layers of fine copper mesh electroplated or sintered together...