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Keywords: Solder Joint Reliability
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Journal Articles

Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021106.
Paper No: EP-21-1010
https://doi.org/10.1115/1.4052070
Published Online: October 6, 2021
... board 21 01 2021 17 06 2021 06 10 2021 PHM canary structures solder joint reliability FE simulation thermomechanical warpage Electronics subjected to thermal cycling loads are prone to solder joint fatigue as a prevalent failure mechanism. Unavoidable differences...
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Topics: Failure, Fatigue, Printed circuit boards, Resistors, Simulation, Solder joints, Solders, Stress, Thermomechanics, Warping
Journal Articles

Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

C. Basaran, H. Ye, D. C. Hopkins, D. Frear, J. K. Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 157–163.
https://doi.org/10.1115/1.1898338
Published Online: September 15, 2004
... test modules were damaged due to re-polishing after the nano-indentation tests; 2 test modules survived more than 3000 h of stressing. Table 1 shows the test vehicle number and applied current levels for each module tested. Flip Chip Solder Joint Reliability Electromigration...
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Topics: Current density, Electrodiffusion, Failure, Flip-chip, Flip-chip devices, Solder joints, Failure mechanisms, Nucleation (Physics)