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Keywords: Thermal Interface
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041007.
Paper No: EP-13-1115
Published Online: September 19, 2014
... P ACKAGING . Manuscript received October 6, 2013; final manuscript received July 18, 2014; published online September 19, 2014. Assoc. Editor: Ashish Gupta. 06 10 2013 18 07 2014 A sensor is developed for simple, in situ characterization of dielectric thermal interface materials...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031007.
Published Online: June 23, 2009
... Polymeric Thermal Interface Materials ,” IEEE Trans. Compon. Packag. Technol. 1521-3331 , 28 , pp. 230 – 237 . 10.1109/TCAPT.2005.848492 Covey , G. H. , and Stanmore , B. R. , 1981 , “ Use of the Parallel-Plate Plastometer for the Characterization of Viscous Fluids With a Yield Stress...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 319–323.
Published Online: June 1, 2006
...Zongrong Liu; D. D. L. Chung Wax (predominantly tricosane paraffin wax, with a melting temperature of 48 ° C ) filled with hexagonal boron nitride (BN) particles ( 5 - 11 μ m ) was found to be an effective phase-change thermal interface material. The thermal contact conductance, as measured...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 188–191.
Published Online: July 26, 2002
...Yunsheng Xu; Xiangcheng Luo; D. D. L. Chung Polyethylene-glycol-based thermal interface paste containing trifluoroacetic acid lithium salt (1.5 wt. percent optimum) and boron nitride particles (∼18.0 vol. percent optimum), as well as water and N, N-dimethylformamide for helping the dissociation...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2001, 123(3): 309–311.
Published Online: June 26, 2000
...Xiangcheng Luo,; Yunsheng Xu, and; D. D. L. Chung Thermal interface pastes based on silicone, lithium doped polyethylene glycol (PEG), and sodium silicate were evaluated in their performance before and after heating up to 120°C. The thermal contact conductance of any of the pastes between copper...
