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Keywords: atomic force microscopy
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041101.
Published Online: November 13, 2008
... ), a technique sometimes called picosecond ultrasonics. Experimental PPPT obtained on Si/SiGe superlattice structure covered by the 100 nm Al film 01 10 2007 08 09 2008 13 11 2008 atomic force microscopy integrated circuit reliability nanoelectronics nanowires phase...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 246–250.
Published Online: November 29, 2005
... dispersive x-ray, atomic force microscopy, focused ion beam, and an Intellectest STORM series FA1500 shear tester were used as analytical tools in this study. The results suggest that the first zincation process follows the contour of the initial bond pad. The second zincation produces a slightly better...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 120–123.
Published Online: April 30, 2004
... the effect of cleaning, various combinations of SPM and RCA were investigated (i.e., only SPM, only RCA, SPM after RCA, and RCA after SPM). Surface roughness before and after cleaning were analyzed by AFM (atomic force microscopy). Four-inch diameter borosilicate 7740 Pyrex glass wafers and Si wafers...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 345–351.
Published Online: December 12, 2002
... atomic force microscopy integrated circuit reliability nondestructive testing correlation methods flip-chip devices image processing crack detection Quality and suitability of thermo-mechanical design and optimization of advanced electronic packages by means of finite element analysis (FEA...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 362–366.
Published Online: December 12, 2002
... films permittivity surface topography atomic force microscopy surface chemistry X-ray photoelectron spectra integrated circuit technology As polymer dielectric materials appear to be the immediate successor to oxide interlevel dielectrics (ILDs), industry and academia have begun...