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Keywords: bismuth alloys
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 308–316.
Published Online: October 6, 2004
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received June 2003; final revision, February 2004. Associate Editor: D. Agonafer. 01 June 2003 01 February 2004 06 10 2004 copper transient analysis metal foams bismuth alloys tin alloys lead alloys indium alloys heat sinks...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 2002, 124(3): 314.
Published Online: July 26, 2002
...Howard H. Manko,, Author; Anthony J. Rafanelli,, Reviewer 26 07 2002 soldering lead materials properties bismuth alloys silver alloys indium alloys surface cleaning Solders and Soldering, Fourth Edition , by Howard H. Manko. McGraw-Hill, New York, NY, 2001, 519 pp...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 48–54.
Published Online: September 3, 1999
... thermal stresses soldering eutectic alloys tin alloys bismuth alloys lead alloys silver alloys failure (mechanical) packaging 30 June 1999 03 September 1999 Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING...
