... impeded by a bigger one. 04 06 2007 03 12 2007 01 08 2008 chemical interdiffusion copper copper alloys current density dissolving electromigration finite element analysis flip-chip devices integrated circuit packaging silver alloys soldering solders tin alloys voids...

... chemical interdiffusion encapsulation In microelectronics packaging, gold wire is the most common wire material used as an interconnection from IC pads to the leadframe. The increasing demand in enhancing reliability and material cost saving, however, raises the attention on thermosonic ball...

... will cause the interface in the solder joint to be more sensitive to stress 1 2 . Plastic BGA Solder Joint Cooling Rate Cu-Sn Intermetallics Intermetallic Compound Growth copper alloys tin alloys reflow soldering ball grid arrays plastic packaging annealing chemical interdiffusion...

... ENGINEERS . Manuscript received by the Electronic and Photonic Packaging Division August 3, 1998. Assoc. Editor: Y.-H. Pao. 03 August 1998 26 07 2002 reflow soldering chemical interdiffusion integrated circuit metallisation thick film circuits hybrid integrated circuits...

...: D. T. Read. 23 June 1999 27 June 2000 soldering chemical interdiffusion Formation and growth of an intermetallic compound (IMC) phase in solder joints has been intensively studied experimentally and theoretically (Yost et al. 1 ; Romig et al. 2 ; Wu et al. 3...