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Keywords: compact
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031013.
Published Online: September 30, 2011
... the simulation tool capabilities and requires new modeling methodologies able to define the most significant thermal model. Based on DEvelopment of Libraries of PHysIcal models (DELPHI) methodology, the creation of a compact thermal model, compliant to a set of boundary conditions was investigated for a local...
