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Keywords: condensation
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031004.
Paper No: EP-21-1020
Published Online: September 15, 2021
... acting as a thermal diode. The low-profile assembly takes advantage of the phase-changing properties of water inside a sealed chamber. The wettability-patterned plate—when on the cooled side, e.g., forward operation mode—enables spatially controlled dropwise condensation (high heat transfer rate...
Journal Articles
Sushma Madduri, Bahgat G. Sammakia, William Infantolino, Satish C. Chaparala, Lawrence C. Hughes, J. Micheal Harris
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011008.
Published Online: March 19, 2012
...Sushma Madduri; Bahgat G. Sammakia; William Infantolino; Satish C. Chaparala; Lawrence C. Hughes; J. Micheal Harris This paper presents a performance study done on a semiconductor laser diode in a moisture condensing environment. Devices with laser diodes are used in a wide variety of electronic...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 317–324.
Published Online: October 6, 2004
..., a horizontal condenser, a rubber bag attached at the exit of the condenser, a downcomer, a mass flow meter, and a liquid subcooler. The loop height H was set at either 250 or 450 mm. FC-72 was filled in the test loop up to some level of loop height and the upper part was filled with air. During the operation...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 276–281.
Published Online: June 10, 2003
... May 17, 2002. Associate Editor: R. R. Schmidt. 26 February 2000 17 May 2002 10 06 2003 cooling boiling condensation thermal management (packaging) thermal analysis thermal resistance digital simulation As the power density levels of electronic equipment...