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Keywords: condensation
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031004.
Paper No: EP-21-1020
Published Online: September 15, 2021
... acting as a thermal diode. The low-profile assembly takes advantage of the phase-changing properties of water inside a sealed chamber. The wettability-patterned plate—when on the cooled side, e.g., forward operation mode—enables spatially controlled dropwise condensation (high heat transfer rate...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011008.
Published Online: March 19, 2012
...Sushma Madduri; Bahgat G. Sammakia; William Infantolino; Satish C. Chaparala; Lawrence C. Hughes; J. Micheal Harris This paper presents a performance study done on a semiconductor laser diode in a moisture condensing environment. Devices with laser diodes are used in a wide variety of electronic...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 317–324.
Published Online: October 6, 2004
..., a horizontal condenser, a rubber bag attached at the exit of the condenser, a downcomer, a mass flow meter, and a liquid subcooler. The loop height H was set at either 250 or 450 mm. FC-72 was filled in the test loop up to some level of loop height and the upper part was filled with air. During the operation...
Journal Articles
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 276–281.
Published Online: June 10, 2003
... May 17, 2002. Associate Editor: R. R. Schmidt. 26 February 2000 17 May 2002 10 06 2003 cooling boiling condensation thermal management (packaging) thermal analysis thermal resistance digital simulation As the power density levels of electronic equipment...