...-copper system with a gold-tin solder bond layer. The results obtained are likely to be useful in interfacial stress evaluation and physical design of bimaterial assemblies used in microelectronics and photonics applications. Consider a plate of unit thickness subjected to unit shear stress...

...Chu-Hsuan Sha; Chin C. Lee Formation of pure silver (Ag) flip-chip interconnect of silicon (Si) chips on copper (Cu) substrates is reported. Arrays of Ag columns, each 36 μm in height and 40 μm in diameter, are fabricated on 2-in. Si wafers which are first coated with chromium (Cr)/gold (Au) dual...

... Embedded-Atom Potentials for fcc Metals: Application to Liquid and Solid Copper ,” Phys. Rev. B , 43 ( 6 ), pp. 4653 – 4658 . 10.1103/PhysRevB.43.4653 11 Tsuru , T. , and Shibutani , Y. , 2008 , “ Dislocation Nucleation and Interaction Under Nanoindentation in Single Crystalline Al...

... properties and develop further simulations of natural convection of nanofluids. However, numerical simulations in such complex problems require much longer computation time and memory allocation. computational fluid dynamics cooling copper electronics packaging laminar flow nanofluidics natural...

...Myung Jin Yim; Yi Li; Kyoung Sik Moon; C. P. Wong This paper describes the development and characterization of anisotropically conductive films (ACFs) incorporated with copper (Cu) particles as electrically conductive fillers for environmentally friendly, low cost, high electrical, and high thermal...

... in the present work. Electromigration reliability Metallization η ( h ) β Au/Ni/Cu 3471 2.58 Cu 9363 1.53 Weibull cumulative distributions 13 04 2008 16 10 2008 27 03 2009 copper copper alloys electromigration failure analysis...

...Pin J. Wang; Jong S. Kim; Chin C. Lee A novel process of bonding silver (Ag) foils to copper (Cu) substrates has been developed. This direct bonding method does not use any intermediate layer in between. An important application of this process is electronic packaging where semiconductor device...

... of horizontal copper and resin; outside the BGA-covered area the board is a copper/resin laminate and its surfaces are exposed to cooling air. Calculations are performed on a sample board having the dimensions 11 × 11 cm 2 ( footprint ) × 1.26 mm (thickness). The model of the board has two internal layers...

... impeded by a bigger one. 04 06 2007 03 12 2007 01 08 2008 chemical interdiffusion copper copper alloys current density dissolving electromigration finite element analysis flip-chip devices integrated circuit packaging silver alloys soldering solders tin alloys voids...

..., and coolant flow rate. It was found that the high thermal conductivity copper of the direct bonded copper (DBC) layer is the most feasible location for the channels. Based on a new analytical heat transfer model developed for microchannels in IPEM structures, several design configurations were proposed...

... channel design for an array of generic power amplifier units. Several different channel insert configurations are investigated as miniheat exchangers using both copper fins and graphite foam. Experiments were conducted measuring the chip temperatures as well as the inlet liquid temperature. CFD...

... of the sheared copper bond surfaces reveal sticking of Al which provides qualitative information of the area of the bond between the ball bond and the bond pad. In thermally aged gold ball bonds, the gold above the intermetallic layer fractures. The energy required to fracture a gold or copper ball bond of 1 ml...

...Shankar Krishnan; Suresh V. Garimella A transient thermal analysis is performed to investigate thermal control of power semiconductors using phase change materials, and to compare the performance of this approach to that of copper heat sinks. Both the melting of the phase change material under...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received February 2003. Associate Editor: E. Suhir. 01 February 2003 15 12 2003 gold copper aluminium integrated circuit interconnections integrated circuit packaging integrated circuit reliability ageing lead bonding hardness...

...John H. Lau; Stephen H. Pan In this study, a three-dimensional (3D) nonlinear stress analysis of the tin whisker initiation on a pure matte Sn-plated copper substrate is investigated. The structure is subjected to a compressive stress acting at the Sn layer which is generated by the spontaneous...

...Christopher L. Borst; Dipto G. Thakurta; William N. Gill; Ronald J. Gutmann Successful integration of copper and low dielectric constant (low-k) materials is dependent on robust chemical-mechanical planarization (CMP) during damascene patterning. This process includes the direct removal of copper...

..., 2001. Associate Editor: M. Shiratori. 15 October 2000 08 March 2001 copper integrated circuit interconnections thermal stresses stress relaxation interface phenomena failure analysis finite element analysis integrated circuit modelling diffusion barriers Finite...

...Boris Mirman; Emanuel Bobrov Plastic compressive deformation of the copper layer at high temperatures is a significant contributor for die cracking in the under-bump-metallurgy (UBM) area of flip chips. Safranek, W. H., 1986, “The Properties of Electrodeposited Metals and Alloys,” Handbook...

.... Associate Technical Editor: G. De Mey. 26 Jan 1999 15 Sept 1999 fracture toughness testing copper adhesives fracture mechanics finite element analysis Adhesives are widely used in various industrial applications to reduce weight and costs, and to increase reliability. One...