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Keywords: copper ball bond
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 192–201.
Published Online: November 23, 2005
... of the sheared copper bond surfaces reveal sticking of Al which provides qualitative information of the area of the bond between the ball bond and the bond pad. In thermally aged gold ball bonds, the gold above the intermetallic layer fractures. The energy required to fracture a gold or copper ball bond of 1 ml...
