... optical inspection computerised tomography crack detection flip-chip devices integrated circuit interconnections integrated circuit reliability integrated circuit testing microcracks nondestructive testing printed circuit manufacture solders synchrotron radiation thermal stress cracking X-ray...

... simulations support the experimental results. A reliability estimate for capacitor integrity under given loading conditions is given. 06 11 2007 26 09 2008 13 02 2009 capacitance measurement ceramic capacitors chip scale packaging crack detection failure analysis finite element...

... atomic force microscopy integrated circuit reliability nondestructive testing correlation methods flip-chip devices image processing crack detection Quality and suitability of thermo-mechanical design and optimization of advanced electronic packages by means of finite element analysis (FEA...

... July 30, 1999; revised manuscript received July 18, 2000. Associate Editor: B. Courtois. 13 June 1999 30 July 1999 18 July 2000 integrated circuit packaging plastic packaging delamination microwave imaging integrated circuit reliability inspection crack detection...