...-attach solder joints in Si-based power modules have not been studied because the average current density of the die-attach solder is much smaller than the threshold of electromigration degradation. However, in die-attach solder, the electromigration degradation may appear where current crowding occurs...

... as used in power modules was simulated. Plasticity-creep and longitudinal gradient generated by current crowding have a strong effect on significantly reducing the vacancy concentration at the anode edge over a long period of time. Fig. 12 Boundary conditions of the power device, solder joint...

...Hao Lu; Chun Yu; Peilin Li; Junmei Chen The current density distribution in a line-to-bump structure as a function of cross-sectional area ratio of the electrical conductor was investigated, as well as the effects of current crowding on electromigration and interfacial reaction in lead-free solder...