... with the peak reflow temperature of lead-free (Pb-free) solders used in electronic industries. The Ag foil is quite soft and ductile. It can deform to mate with the Au surface on alumina. Thus, only 1000 psi of static pressure is needed to bring Ag atoms and Au atoms within atomic distance on the interface. Ag...

... in the crystallographic texture. However, very little intergranular rotation was observed over the range of thermomechanical conditions, suggesting the dominance of a grain boundary sliding (GBS) deformation mechanism. Finally, a recently developed unified-creep-plasticity constitutive model for solder deformation...

... strains, the values of the material constants in the elasto-plastic-creep model proposed by the authors are determined. Simulations of the viscoplastic deformations of a Sn–3.0Ag–0.5Cu solder alloy are also conducted to verify the validity of the proposed method. copper alloys creep deformation...

... and different coefficients of thermal expansion of each component make the package deform differently compared to the case of ATC. Traditionally, reliability assessment is conducted by ATC because ATC is believed to have a more severe thermal loading condition compared to PC, which is similar to the actual...

... at the closed end of the gel was attenuated by the resulting deformation in the gel. The resulting pressure profile obeys equations similar to classical shear lag behavior. Poisson’s ratio was easily calculated from the ratio of the two pressures and the aspect ratio of the gel specimen. A series of seven...

...,” wherein deformation of the wirebond during the mold process can potentially cause shortcircuiting. Several prior studies have focused on qualifying the effects of various wirebond and mold process parameters on package wiresweep, but most of these studies are restricted to single (discrete) die packages...

...T. Zhang; S. Rahman; K. K. Choi; K. Cho; P. Baker; M. Shakil; D. Heitkamp This paper presents a global–local methodology for predicting mechanical deformation and fatigue durability of solder joints in electronic packaging systems subject to cyclic thermal loading. It involves a global deformation...

...Katsuhiko Sasaki; Takuji Kobayashi; Ken-ichi Ohguchi Time-dependent deformations such as creep and ratchetting of solder alloys are significant deformation phenomena that need to be understood to ensure the safety and reliability of solder joints in electronic packaging. There is much research...

...Xianjie Yang; Yan Luo; Qing Gao Based on the time dependent multiaxial deformation behavior of 96.5 Sn - 3.5 Ag solder alloy, a constitutive model is proposed which considers the nonproportional multiaxial cyclic deformation properties. In the back stress evolution equations of this model...

...Tadahiro Shibutani; Qiang Yu; Masaki Shiratori As the shrinkage and integration of devices, the creep behavior of tin-based alloys becomes important with microscales. In this paper, the behavior of creep deformation in solder alloys during a nanoindentation test was examined. Nanoindentation creep...

.... In this study, thermally induced deformations and warpages of ACF flip chip assemblies as a function of distance from neutral point (DNP) and ACF materials properties were investigated using in situ high sensitivity moire´ interferometry. For a nondestructive failure analysis, scanning acoustic microscopy...

... of the vapor pressure induced expanison on the material’s deformation is discussed. 22 06 2004 26 06 2004 electronics packaging micromechanics deformation encapsulation vapour pressure integrated circuit modelling Polymer materials have wide applications in microelectronic...

.... It was found that the normal deformation significantly affects the fatigue life of the solder joint. Throughout the whole test conditions at room temperature, Sn ∕ 3.5 Ag ∕ 0.75 Cu solder alloy had longer fatigue life than 63 Sn ∕ 37 Pb alloy. Failure patterns of the fatigue tests were observed and discussed...

... [3] [4] , and Mishkevich and Suhir [5] . However, there still exist some controversies and inconsistencies regarding die stresses, die attach shear and peel stresses, and warpage (deformation) of the assembly. In the study, Suhir’s derivation of the solution is closely examined in details...

... relation from Darveaux was used to model the inelastic deformation of the solder alloy, and the different stress-strain responses resulting from different designs were calculated. The analysis results were used to develop the empirical fatigue model based on the interfacial boundary volume damage criterion...

... Materials ’97, April 16–18, Berlin, Germany, pp. 716–719. Willecke, R., and Ho, P. S., 1997, “Study of Vertical Thermo-Mechanical Properties of Polyimide Thin Films,” Proc. of Micro Materials ’97, April 16–18, Berlin, pp. 721–724. Vogel, D., et al., 1997, “Deformation Analysis on Flip Chip Solder...

... soldering wetting surface tension deformation For area-array flip-chip applications, the use of an integrated underfill/solder bump system at the wafer level 1 2 removes the need for subsequent infiltration required by current viscous underfill materials. Unfortunately, the integrated...

... and organic substrate under both loading conditions. Shadow Moire´ technique has been used to measure the out-of-plane residual deformation of the FTV that underwent simulated loading conditions. These components were then visually inspected and tested functionally. Results were summarized and used...