... conductivity of the high thermal conductivity film layers, with thicknesses between 100 and 500 μ m . 14 01 2005 11 10 2005 thermal management (packaging) heat sinks integrated circuit packaging substrates thermal conductivity measurement dielectric thin films thermal conductivity...

... dielectric thin films integrated circuit packaging reviews In microelectronic manufacturing processes such as wafer processing, packaging, and assembling, polymers are more and more used because of their excellent insulation properties, low dielectric constant, and good chemical resistance. Due...

... 2001, pp. 70–2. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received April 2004. Associate Editor: Y. C. Lee. 01 April 2004 06 10 2004 ageing polymer films dielectric thin films...

... Packaging Division and presented at Poly 2000, London, United Kingdom, December 4–5, 2000. Manuscript received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 polymer films chemical mechanical polishing copper dielectric thin...

... OF ELECTRONIC PACKAGING . Manuscript received by the EEPD April 9, 1999; revision received November 22, 1999. Associate Technical Editor: M. Shiratori. 09 April 1999 22 November 1999 multichip modules dielectric thin films stainless steel substrates Stainless steel offers...