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1-4 of 4
Keywords: diffusion
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031011.
Published Online: July 31, 2009
...B. Xie; X. J. Fan; X. Q. Shi; H. Ding In the present study, the direct concentration approach (DCA) and the whole-field vapor pressure model developed in Part I of this work ( Xie et al., 2009 “Direct Concentration Approach of Moisture Diffusion and Whole Field Vapor Pressure Modeling for Reflow...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031010.
Published Online: July 31, 2009
...B. Xie; X. J. Fan; X. Q. Shi; H. Ding Moisture concentration is discontinuous at interfaces when two materials, which have different saturated moisture concentrations, are joined together. In order to perform moisture diffusion modeling in a multimaterial system such as electronic packages...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 460–465.
Published Online: January 21, 2005
...Xu Chen; Shufeng Zhao; Linda Zhai The moisture absorption experiments of two kinds of molding compound are conducted. The diffusion at low temperature and humidity observes the Fick’s Law, but it does not strictly obey at higher temperature and humidity. The phenomena can be attributed...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 47–51.
Published Online: September 2, 1998
... properties of the compound. Experimental studies were conducted to evaluate the moisture diffusion in compounds with different, from moderate to high, concentration of silica and alumina nitride fillers. The weight-gained analysis indicated that the moisture diffusion was of non-Fickian type and depended...