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Keywords: digital simulation
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. December 2003, 125(4): 465.
Published Online: December 15, 2003
...L. J. Ernst, Guest Editor; G. Q. Zhang, Guest Editor 15 12 2003 thermal management (packaging) digital simulation optimisation micromechanical devices failure analysis This special issue includes selected papers presented at the International Conference of Thermal...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 276–281.
Published Online: June 10, 2003
... May 17, 2002. Associate Editor: R. R. Schmidt. 26 February 2000 17 May 2002 10 06 2003 cooling boiling condensation thermal management (packaging) thermal analysis thermal resistance digital simulation As the power density levels of electronic equipment...
