... through experimentation and finite element analysis. 20 02 2007 03 10 2007 15 05 2008 atomic clocks bimetals chip scale packaging discs (structures) heat conduction switches temperature control thermal management (packaging) The goal of the DARPA chip scale atomic...

... 07 2006 28 12 2006 discs (structures) heat transfer jets multichip modules nozzles turbulence Cooling, heating, and drying processes involving impinging jets have been extensively studied. The well known technique of impinging jets has been used in many applications...