... sensing devices calibration integrated circuit packaging integrated circuit measurement 30 April 2002 10 06 2003 Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division April 30...

.... internal stresses integrated circuit packaging piezoresistive devices electric sensing devices calibration plastic packaging thermal stresses As chip area expands in order to accommodate more functions in modern integrated circuits, the stresses induced in a die in microelectronic packaging...

... February 2000 stress measurement piezoresistive devices electric sensing devices integrated circuit packaging calibration As die size and power density of an microelectronic circuit increased continuously in modern IC technology, stresses induced in a die from packaging becomes serious...