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Keywords: electron-mobility
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011003.
Published Online: March 4, 2010
... results were estimated adequately from the residual stress predicted by numerical and experimental analyses and from the stress-sensitivity of the nMOSFETs measured by the four-point bending method. Also, we tested the validity of an electron-mobility model that included the effect of stress. The electron...
