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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 215–225.
Published Online: June 16, 2005
...-of-the-art for heat sinks in electronics components is lacking in heat transfer enhancement technologies, which is common in turbine heat transfer practice. Therefore, the primary goal of this paper is to examine the turbomachinery cooling technologies and to inform the packaging engineers about the thermal...