... error was reduced from 50% to 3.3% for the 36 pillar array. finite element analysis flip-chip devices optimisation A second simplification method was used to simplify the octant model to reduce the DOF and computation time while maintaining accuracy of the 3D models. The GPD model was cut...

..., pure Ag joints have superior electrical and thermal properties. 27 01 2011 13 06 2011 30 09 2011 30 09 2011 bonding processes chromium copper electric properties flip-chip devices gold packaging silver soldering thermal expansion silver joints flip-chip...

... optical inspection computerised tomography crack detection flip-chip devices integrated circuit interconnections integrated circuit reliability integrated circuit testing microcracks nondestructive testing printed circuit manufacture solders synchrotron radiation thermal stress cracking X-ray...

..., underfill material properties are crucial to package reliability performance ( 1 2 ). amine-based phenolic-based reliability underfill adhesion ball grid arrays flip-chip devices fracture toughness testing plastic packaging reliability thermal expansion Young's modulus 06 08...

...) of chip during realignment 29 11 2009 25 09 2010 08 12 2010 08 12 2010 chip-on-board packaging Couette flow flip-chip devices interconnections reflow soldering solders viscosity wafer bonding flip chip no flow viscous misalignment self-alignment solder...

... flip-chip devices light emitting diodes principal component analysis Taguchi methods light emitting diode thermo-ultrasonic flip-chip bonding Taguchi method principle component analysis gray relational analysis LED flip-chip bonding technology can make fabricated chips lighter...

... and utilized in production. On the other hand, the preliminary results in this study show that Ag flip-chip joints can indeed be fabricated at 250 ° C . 31 08 2009 01 05 2010 30 09 2010 30 09 2010 flip-chip devices integrated circuit bonding silver joints flip-chip direct...

... underfilled with one of five different materials after soldering with SnCu, SAC305, and SnPb. adhesion copper alloys flip-chip devices lead alloys reliability solders stress analysis thermal expansion thermal shock tin alloys So far, flip chip assembly is exempt from the requirement...

...-chip devices integrated circuit reliability shrinkage thermal expansion 2010 American Society of Mechanical Engineers ...

... the emitting source and the ambient environment; therefore, it improves the thermal dispersion efficiency of the LED package. 28 09 2008 11 07 2009 21 10 2009 data communication electronics packaging flip-chip devices light emitting diodes optical fibre networks POF flip-chip...

... high I/O density no-flow underfill void formation gas chromatography-mass spectrum chemical reaction differential scanning calorimetry electronics packaging flip-chip devices lead mass spectroscopic chemical analysis solders tin 25 03 2009 18 04 2009 31 07 2009...

...-chip devices interconnections reliability thermal analysis flip chip package capillary-flow underfill no-flow underfill assembly process warpage reliability Till now, the standard UF processes employed for F/C packages use capillary-flow underfill (CUF) materials ( 6 7 ). However...

... flip-chip devices gold alloys metallisation nickel alloys silver alloys solders substrates tin alloys electromigration reliability flip-chip solder joint substrate pad metallization An earlier version of this paper was published in Proceedings of 56th Electronic Components...

... accuracy at a relatively low cost. laser ultrasound flip chip solder bump local temporal coherence lead-free laser vibrometer chip scale packaging electronics packaging flip-chip devices laser beam applications light interferometry solders thermoelasticity ultrasonic applications...

... electronics packaging fatigue testing flip-chip devices life testing nanostructured materials passivation reliability silicon compounds thermal shock thermomechanical treatment Underfill materials are used in flip chip assemblies to enhance the thermomechanical reliability of the solder bumps...

... interconnects to fail earlier than in ATC while the ceramic package fails earlier in ATC always. 06 02 2007 02 04 2008 17 11 2008 ball grid arrays ceramic packaging computational fluid dynamics deformation finite element analysis flip-chip devices integrated circuit interconnections...

..., the measured insertion loss is less than 3 dB for frequencies of up to 35 GHz and the return loss is higher than 15 dB for frequencies of up to 29 GHz using CPS flip-chip configuration. 11 12 2007 09 04 2008 17 11 2008 coplanar waveguides flip-chip devices integrated circuit...

... enhance the electromigration reliability. 01 08 2007 07 01 2008 13 11 2008 copper alloys electromigration flip-chip devices gold nickel reliability silver alloys solders tin alloys titanium vanadium electromigration flip-chip solder joint reliability Sn–Ag–Cu Cu...

... impeded by a bigger one. 04 06 2007 03 12 2007 01 08 2008 chemical interdiffusion copper copper alloys current density dissolving electromigration finite element analysis flip-chip devices integrated circuit packaging silver alloys soldering solders tin alloys voids...

..., and experimental methods. In particular, this paper discusses the analytical modeling, numerical modeling, and transient out-of-plane displacement measurements for a 6.35 × 6.35 × 0.6 mm 3 PB18 flip chip mounted on a FR4 board. 14 08 2007 07 01 2008 01 08 2008 flip-chip devices inspection...