..., and high glass transition temperature leads to the longest service life. Popelar , S. , and Roesch , M. , 2000 , “ Flip Chip Reliability Modeling Based on Solder Fatigue as Applied to Flip Chip on Laminate Assemblies ,” Int. J. Microcircuits Electron. Packag. , 23 ( 4 ), pp. 462 – 468...

... expansion (CTE or α), glass transition temperature T g , and shear modulus G ′ and G of the molded specimens were measured by various thermal analysis techniques. The glass transition temperature was shown to be a good and direct measure of the degree-of-cure. The CTEs ( α 1 and α 2 ) , G ′ and G ″ were...