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Keywords: high purity Al film
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Journal Articles

Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films

X. Zhao, M. Saka, M. Yamashita, F. Togoh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021003.
https://doi.org/10.1115/1.4001687
Published Online: June 11, 2010
...X. Zhao; M. Saka; M. Yamashita; F. Togoh This paper is focused on evaluating the dominant factor for electromigration (EM) in sputtered high purity Al films. A closed-form equation of atomic flux divergence by treating grain boundary diffusion and hillock formation in a polycrystalline structure...
View Article titled, Evaluation of the Dominant Factor for Electromigration in Sputtered <span class="search-highlight">High</span> <span class="search-highlight">Purity</span> <span class="search-highlight">Al</span> <span class="search-highlight">Films</span>
Open the PDF for Evaluation of the Dominant Factor for Electromigration in Sputtered <span class="search-highlight">High</span> <span class="search-highlight">Purity</span> <span class="search-highlight">Al</span> <span class="search-highlight">Films</span> in another window
Topics: Current density, Diffusion (Physics), Electrodiffusion, Grain boundary diffusion, Grain size, Temperature, Sputtering (Irradiation), Circuits, Damage, Strips