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Keywords: hygro-thermo-mechanical model
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021004.
Published Online: June 11, 2010
... reliability hygro-thermo-mechanical model Moisture sensitivity of electronic package has been of a great concern in the electronic industry for decades. Significant work ( 1 2 3 4 5 6 7 8 9 10 11 12 ) has been done on moisture material property characterization, moisture absorption...
