1-2 of 2
Keywords: light emitting diode
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Packaging of Phosphor Based High Power White LEDs: Effects of Phosphor Concentration and Packaging Configuration

Yuan-Chang Lin, Jiun Pyng You, Nguyen T. Tran, Yongzhi He, Frank G. Shi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011009.
https://doi.org/10.1115/1.4003216
Published Online: March 10, 2011
...Yuan-Chang Lin; Jiun Pyng You; Nguyen T. Tran; Yongzhi He; Frank G. Shi Two types of packaged white light emitting diodes in which one has a flat-top (FT) emitting surface and the other is a flat-top-with-lens (FTWL) type are fabricated by using the same leadframe and investigated on their optical...
View Article titled, Packaging of Phosphor Based High Power White LEDs: Effects of Phosphor Concentration and Packaging Configuration
Open the PDF for Packaging of Phosphor Based High Power White LEDs: Effects of Phosphor Concentration and Packaging Configuration in another window
Topics: Light-emitting diodes, Phosphors, Packaging
Journal Articles

Multi-Objective Optimization of Thermo-Ultrasonic Flip-Chip Bonding Process for High-Brightness Light Emitting Diodes

Chung-Feng Jeffrey Kuo, Hui-Ta Chen, Te-Li Su, Jr-Da Huang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041006.
https://doi.org/10.1115/1.4002727
Published Online: November 24, 2010
... component analysis and gray relational analysis to determine the optimal processing parameters for multiple quality characteristics of light emitting diodes (LEDs). The quality characteristics of this experiment include the candle light, forward voltage, and leakage current of LED and thrust value. First...
View Article titled, Multi-Objective Optimization of Thermo-Ultrasonic Flip-Chip Bonding Process for High-Brightness <span class="search-highlight">Light</span> <span class="search-highlight">Emitting</span> <span class="search-highlight">Diodes</span>
Open the PDF for Multi-Objective Optimization of Thermo-Ultrasonic Flip-Chip Bonding Process for High-Brightness <span class="search-highlight">Light</span> <span class="search-highlight">Emitting</span> <span class="search-highlight">Diodes</span> in another window
Topics: Bonding, Flip-chip, Light-emitting diodes, Leakage, Taguchi methods