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Keywords: micro-via
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021119.
Paper No: EP-21-1057
Published Online: April 22, 2022
... manufactured using laser drilling of vias, chemical etching of conductive layers, comes out to be very expensive, but something which can easily be addressed using aerosol jet technique. aerosol jet multi-layer micro-via dielectric control chart process capability regression model printed...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011005.
Published Online: January 31, 2008
... circuits silver alloys solders tin alloys reliability flip chip thermal cycling micro-via Thermal excursions for electronic devices imparted during their operation can change the microstructure of their solder joints and cause the stress concentration, resulting in deformation and crack...