... current density electromigration electronics packaging failure analysis numerical analysis reliability sensitivity analysis solders electromigration sensitivity analysis time-to-failure It is well known that, as the electronics industry continues to push for high performance...

... than that made from SAC105 no matter on Cu or electroless Ni. Moreover, the fracture was found at the interface between the Cu foil and epoxy in the halogen-free test device. Numerical analysis showed that the thickness of IMC layer dominated the pull strength of the solder joint because the Z-axial...

... Transfer and Fluid Flow , Taylor & Francis , London . 21 04 2009 17 02 2010 20 05 2010 20 05 2010 air conditioning computer centres numerical analysis data center air flow distribution CRAC modeling numerical modeling Data centers house many...

... reflow electronic package multiscale analysis diffusion integrated circuit packaging moisture numerical analysis vapour pressure 09 01 2008 22 03 2009 31 07 2009 2009 American Society of Mechanical Engineers ...

... to Bejan’s Theory ,” Int. J. Heat Mass Transfer 0017-9310 , 50 ( 11–12 ), pp. 2132 – 2138 . 10.1016/j.ijheatmasstransfer.2006.11.006 Lorenzini , G. , and Moretti , S. , 2007 , “ Numerical Analysis on Heat Removal From Y-Shaped Fins: Efficiency and Volume Occupied for a New Approach...

... Based Optimization of Functional Block Distributions in a Non-Uniformly Powered Die,” InterPACK 2005, San Francisco, CA, Jul. 17–22 ) has been done, which includes numerical analysis and thermal based optimization of a typical package consisting of a nonuniformly powered die, heat spreader, thermal...

... Convection (Still Air) ,” EIA/JESD51-2. 23 08 2007 15 04 2008 11 02 2009 ball grid arrays chip scale packaging circuit reliability numerical analysis thermal analysis An earlier version of this paper was published in Proceedings of IMECE 2007 (ASME International...

...) detailed numerical analysis models directly connected to optimization algorithms, (2) design of experiments (DoE), and (3) artificial neural networks (ANNs) have been proposed as new trends in this field. These methodologies have led to significant improvement in design optimization capabilities, while...

... , Precis. Eng. 0141-6359 10.1016/S0141-6359(02)00182-4 , 27 , pp. 42 – 50 . Brakke , K. A. , Surface Evolver Manual, Version 2.20, Susquehanna University, 2003 . 28 10 2006 25 06 2007 12 02 2008 numerical analysis optoelectronic devices scanning electron...

... 01 2006 semiconductor thin films Boltzmann equation ballistic transport thermal conductivity phonon dispersion relations numerical analysis Current microfabrication technologies have allowed the semiconductor industry to produce smaller electronic devices and components...

... presents a fundamental concept and principles of resin self-alignment processes. The numerical analysis is conducted to enhance understandings of resin self-alignment behavior and the relationship between process-related parameters. It was proved that resin self-alignment is different from the oscillatory...

... and reduce the velocity. heat sinks multichip modules heat transfer thermal analysis flow simulation jets optimisation numerical analysis 11 June 2004 10 August 2004 24 01 2005 Manuscript received June 11, 2004; revision received August 10, 2004. Review conducted...

... ventilation natural convection numerical analysis flow simulation The power dissipation density of electronic equipment has increased in recent years and, as a result, it is necessary to consider the cooling design of electronic equipment in order to develop suitable cooling techniques...

... packaging reduced order systems heat transfer thermal analysis numerical analysis Integrated Power Electronics Reduced Thermal Model Lumped Thermal Capacitance The present technology provides the continuous development of new semiconductor materials, which in turn allows...

... October 8, 2003; revision received June 14, 2004. Review conducted by: Z. Suo. 08 October 2003 14 June 2004 24 01 2005 thermal management (packaging) chip scale packaging natural convection thermal analysis laminar flow coolants water numerical analysis surface mount...

... May 2003; final revision, April 2004. Associate Editor: B. Sammakia. 01 May 2003 01 April 2004 24 01 2005 semiconductor lasers optical modulation optical communication equipment thermal resistance numerical analysis The tremendous increase in the number of users...

.... The results indicate good agreement (∼6% discrepancy) between the numerical model and the measurement. electronics packaging thermal resistance thermal conductivity radio equipment lead bonding thermal analysis microassembling numerical analysis Projected increases in interconnect density...

... May 2004 05 October 2004 24 01 2005 electronics packaging HVAC heat transfer computational fluid dynamics compressible flow flow simulation turbulence numerical analysis Heat loads of data processing equipment continue to increase at a rapid rate. This increasing heat...

... osmosis numerical analysis mixing Recent progress of the surface micromachining technology expands the frontier of engineering applications. Some of them include microsystems that handle tiny amounts of liquid for various applications. The microsystems, such as μ TAS or microreactors...

.... 01 April 2003 01 November 2003 08 07 2004 solders flow through porous media plastic flow permeability numerical analysis flip-chip devices flow simulation Flip chip interconnects are being used in the electronics industry and have inherent advantages over other...