1-8 of 8
Keywords: optimization
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011009.
Paper No: EP-23-1023
Published Online: December 11, 2023
... on solder joint stress. Optimization of assembly parameters was achieved through the application of the Taguchi method. An extensive analysis was conducted using different assembly parameter combinations, employing the L9(3 4 ) orthogonal array design to explore the thermal cycling effects. The computed...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011003.
Paper No: EP-19-1078
Published Online: June 4, 2020
... phosphor diameters, and using finned phosphor layers were considered as optimization measures to improve the heat dissipation performance of LED filament lamps. When these optimization measures are applied, chip junction temperatures are reduced. A reduction of 6.9 °C is seen when the lamp radius...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011006.
Paper No: EP-14-1013
Published Online: October 6, 2014
... Electronics: Review and Prospects ,” 18th International Conference on Thermoelectrics , Baltimore, MD, Aug. 29–Sept. 2, pp. 270 – 279 . 10.1109/ICT.1999.843385 [16] Hodes , M. , 2012 , “ Optimal Design of Thermoelectric Refrigerators Embedded in a Thermal Resistance Network ,” IEEE Trans. Compon...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011010.
Paper No: EP-13-1054
Published Online: February 14, 2014
... Conference on Micro Electro Mechanical Systems ( MEMS '99 ), Orlando, FL, January 17–21, pp. 171 – 176 . 10.1109/MEMSYS.1999.746799 [7] Husain , A. , and Kim , K.-Y. , 2010 , “ Enhanced Multi-Objective Optimization of a Microchannel Heat Sink Through Evolutionary Algorithm Coupled...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031006.
Published Online: September 14, 2011
...M. O. Özdemir; H. Yüncü The objective of this study is to predict numerically the optimal spacing between parallel heat generating boards. The isothermal boards are stacked in a fixed volume of electronic package enclosed by insulated lateral walls, and they are cooled by laminar forced convection...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2011, 133(1): 014501.
Published Online: March 9, 2011
...Hsien-Cheng Tseng Advanced collector-up (C-up) heterojunction bipolar transistors (HBTs) with the thermal-via configuration (TVC) have been analyzed using a genetic algorithm (GA). Novel packaging structures are presented and evaluated in detail. With careful optimization, the thermal performance...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021005.
Published Online: April 1, 2009
...Afzal Husain; Kwang-Yong Kim A microchannel heat sink shape optimization has been performed using response surface approximation. Three design variables related to microchannel width, depth, and fin width are selected for optimization, and thermal resistance has been taken as objective function...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 208–216.
Published Online: June 10, 2003
...Avram Bar-Cohen; Madhusudan Iyengar; Allan D. Kraus The effort described herein extends the use of least-material single rectangular plate-fin analysis to multiple fin arrays, using a composite Nusselt number correlation. The optimally spaced least-material array was also found to be the globally...