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Keywords: parametric studies
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 496–502.
Published Online: March 30, 2005
...-step dynamic-static analysis. The dynamic analysis is first performed to evaluate the PCB bending moment adjacent the package, and is followed by a static analysis where the PCB bending moment is applied around the package. Parametric studies performed suggest a fundamental difference in designing...
