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Keywords: particle reinforced composites
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 323–327.
Published Online: December 12, 2002
... polymers reflow soldering delamination particle reinforced composites The reflow soldering process using whole heating is widely used for surface mount technology. In plastic encapsulated semiconductor packages, such as illustrated in Fig. 1 , cracks may be caused in the resin during the reflow...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 188–191.
Published Online: July 26, 2002
... and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD May 3, 2001. Associate Editor: Z. Suo. 03 May 2001 26 07 2002 filled polymers particle reinforced composites thermal resistance packaging cooling Polymer...
