... photoresists piezoresistive devices pressure sensors silicon piezoresistive pressure sensor photoresist packaging sacrificial layer In the packaging process, the principal concern is to protect the delicate components of the sensor while retaining an opening (i.e., a sensing channel) above...

... June 2003. Associate Editor: Y. C. Lee. 01 May 2001 01 June 2003 15 12 2003 pressure sensors piezoresistive devices finite element analysis Various kinds of pressure sensors have been produced 1 . One of them is the Differential Pressure Feedback (DPFE) Sensor...

... the calibration process complex and inefficient. Furthermore, the calibration methodology we used before can only be employed at room temperature so that temperature independent piezoresistive coefficients were presumed for packaging stress extraction. piezoresistive devices stress measurement electric...

.... internal stresses integrated circuit packaging piezoresistive devices electric sensing devices calibration plastic packaging thermal stresses As chip area expands in order to accommodate more functions in modern integrated circuits, the stresses induced in a die in microelectronic packaging...

... February 2000 stress measurement piezoresistive devices electric sensing devices integrated circuit packaging calibration As die size and power density of an microelectronic circuit increased continuously in modern IC technology, stresses induced in a die from packaging becomes serious...