... PACKAGING . Manuscript received Sept. 2001; final revision, March 2002. Associate Editor: A. Y.-H. Hung. 01 Sep 2001 01 March 2002 17 09 2003 thermal conductivity contact resistance filled polymers shear modulus percolation Particle-laden polymeric thermal interface...

... method for predicting the thin small outline packages (TSOP) warpage. The results indicate that viscoelastic-GK calculation with relaxation of shear modulus and of bulk modulus using the multilayer shell element is the most appropriate method for predicting the warpage. All calculations confirm...

... expansion (CTE or α), glass transition temperature T g , and shear modulus G ′ and G of the molded specimens were measured by various thermal analysis techniques. The glass transition temperature was shown to be a good and direct measure of the degree-of-cure. The CTEs ( α 1 and α 2 ) , G ′ and G ″ were...