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Keywords: shear turbulence
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Journal Articles

Jet Impingement Cooling of Chips Equipped With Cylindrical Pedestal Profile Fins

Y. S. Chung, D. H. Lee, P. M. Ligrani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 106–112.
https://doi.org/10.1115/1.1849235
Published Online: June 3, 2005
... integrated circuit testing heat sinks jets shear turbulence stagnation flow temperature distribution convection flow separation cooling Continued miniaturization of integrated chips is a consequence of recent developments in semiconductor technology and integrated circuit manufacturing...
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Topics: Flat plates, Flow (Dynamics), Flow visualization, Nozzles, Pressure, Liquid crystals, Temperature distribution, Fins, Jets, Testing
Journal Articles

An Investigation Into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature

Peter Rodgers, Vale´rie Eveloy, M. S. J. Hashmi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 67–75.
https://doi.org/10.1115/1.1849234
Published Online: March 21, 2005
.... Manuscript received June 29, 2003; revision received June 27, 2004. Review conducted by: B. Sammakia. 29 June 2003 27 June 2004 21 03 2005 integrated circuit packaging thermal management (packaging) surface mount technology flow simulation computational fluid dynamics shear...
View Article titled, An Investigation Into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature
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Topics: Computational fluid dynamics, Flow (Dynamics), Heat transfer, Junctions, Modeling, Temperature, Turbulence, Viscosity, Eddies (Fluid dynamics), Air flow