... for calibration at temperature other than room temperature. Piezoresistive stress sensors have been demonstrated to be a suitable tool for stress measurements on chips inside microelectronic packaging because the measurements are in-site, nondestructive, efficient, and low cost 1 2 3 4 5 . To accurately...

...Ben-Je Lwo; Ching-Hsing Kao; Tung-Sheng Chen; Yao-Shing Chen Stress measurements in microelectronic packaging through piezoresistive sensors take the advantage of both in-situ and nondestructive. In this study, test chips with both p-type and n-type piezoresistive stress sensors, as well as a heat...

... Stress Measurements ,” ASME J. Eng. Mater. Technol. , 103 , pp. 157 – 163 . Nelson , D. , Fuchs , E. , Makino , A. , and Williams , D. , 1994 , “ Residual Stress Determination by Single Axis Holographic Interferometry and Hole Drilling, Part II: Experiments ,” Exp. Mech. , 3...