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Keywords: structural dynamics
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 98–104.
Published Online: April 18, 2006
...Chang-Lin Yeh; Yi-Shao Lai The ball impact test is developed as a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. Following classical structural dynamics principles...
