... 07 2009 09 08 2010 09 12 2010 09 12 2010 aluminium alloys gold alloys integrated circuit metallisation integrated circuit packaging lead bonding scanning electron microscopy surface topography ball bonding bonding parameters gold aluminide surface topographical...

...M. K. Md Arshad; I. Ahmad; A. Jalar; G. Omar; U. Hashim This paper reports the effects of a multiple zincation process on the Al bond pad surface prior to electroless nickel immersion gold deposition. The study of multiple zincation comprises the surface topography and morphology of the appearance...

... measurements, post-CMP surface topography from AFM scans, and post-CMP surface chemistry from XPS measurements. Physically based wafer-scale models are presented which are compatible with the experimental results. Two distinct regimes of CMP operation are possible depending upon the slurry film thickness...

... reliability interface roughness polymers cracks surface topography metals flip-chip devices adhesion aluminium 16 April 2001 02 05 2002 Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . April 16, 2001. Associate...