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Keywords: thermal cyclic
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011009.
Paper No: EP-23-1023
Published Online: December 11, 2023
...Chao Gao; Chunyue Huang; Liang Ying A finite element simulation analysis model was developed for a plastic ball grid array (PBGA) assembly to analyze its behavior under thermal cyclic loading conditions. The stress distribution in the SAC305 solder joints at different locations within the array...