... fatigue thermal cycling BGA surrogate-model The ever-rising electrification and the increasing percentage of electrified vehicles lead to a wider range of electronic equipment. Due to changing thermal loads and vibrations, these components need to withstand challenging conditions during...

... are performed for sintered silver in typical die-attach interconnection under different thermal cycles. Based on thermal cycling test, the Young's modulus and hardness of sintered silver layer have been presented. It is found that the Young's modulus and hardness of sintered silver layer changes slightly...

..., as potential midtemperature mPCM, has been evaluated. The results suggest that these mPCMs maintain their thermo-physical stability over large periods of thermal cycles. This work is in part a work of the U.S. Government. ASME disclaims all interest in the U.S. Government's contributions. 12 01...

...Mahsa Montazeri; Cody J. Marbut; David Huitink In this work, a rapid and low-cost accelerated reliability test methodology which was designed to simulate mechanical stresses induced in flip–chip bonded devices during the thermal cycling reliability test under isothermal conditions, is introduced...

... thermal cycling is complex, and their small dimensions prevent direct measurements from being performed. This paper reports the experimentation based on strain gage measurements, allowing the construction of the shear stress–strain hysteresis loop corresponding to Sn3.0Ag0.5Cu (SAC305) solder joints...

... in thermal cycling together with controls soldered with a SAC305 paste. Mixed joints were found to outperform pure SAC305 in −40/125°C tests but not in 0/100°C, and general trends suggest that mixed joints may compare more poorly in service. 27 09 2009 03 02 2011 22 06 2011 22 06 2011...

...Dezhi Li; Changqing Liu; Paul P. Conway The reliability of fine pitch Sn–3.8Ag–0.7Cu flip chip solder joints with three different pads, i.e., bare pads, pads with solder masks, and pads with microvia, on printed circuit boards (PCBs) was studied through thermal cycling. After assembly, ( Au , Ni...

...Hai Bo Fan; Edward K. L. Chan; Cell K. Y. Wong; Matthew M. F. Yuen Interfacial failure under thermal cycling conditions is one of the main concerns in package design. To minimize such failure in multi-layered electronic assemblies and packages, it is important to develop a better understanding...

...Tong Hong Wang; Chang-Chi Lee; Yi-Shao Lai; Yu-Cheng Lin In this work, thermal characteristics of a board-level chip-scale package, subjected to coupled power and thermal cycling test conditions defined by JEDEC, are investigated through the transient thermal analysis. Tabular boundary conditions...