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Keywords: thermal expansion measurement
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 345–351.
Published Online: December 12, 2002
..., United Kingdom, December 4–5, 2000. Manuscript received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 integrated circuit packaging strain measurement deformation thermal expansion measurement displacement measurement...
