... of China 10.13039/501100001809 51975594 National Natural Science Foundation of China 10.13039/501100001809 U20A6004 microelectronics packaging flip chip reliability electric-thermal-force multi-field coupling high current density thermal interface material 11 07 2021 13...

.... The improvement of flip chip reliability by using thermal interface materials was studied. First, a three-dimensional finite element model of the flip chip packaging system and the finite element simulation of electric-thermal-force multifield coupling were conducted. Then, the Joule heating, temperature...

... operation temperature. The pluggable nature of the modules requires dry contact thermal interfaces that permit repeated insertion–disconnect cycles under low compression pressures (∼10 to 100 kPa). Conventional wet thermal interface materials (TIM), such as greases, or those that require high compression...

...S. Shanmugan; O. Zeng Yin; P. Anithambigai; D. Mutharasu All solid-state lighting products produce heat which should be removed by use of a heat sink. Since the two mating surfaces of light emitting diode (LED) package and heat sink are not flat, a thermal interface material (TIM) must be applied...

..., 2014. Assoc. Editor: Masaru Ishizuka. 07 09 2013 04 04 2014 AlN thin film was coated over Cu substrate (575 mm 2 ) with 400 nm thickness using DC sputtering for thermal interface material (TIM) application. Aluminum Nitride (AlN)-coated Cu substrate (AlN/Cu) was used as a heat sink...

...Rui Zhang; Jian Cai; Qian Wang; Jingwei Li; Yang Hu; Hongda Du; Liangliang Li References [1] Sarvar , F. , Whalley , D. C. , and Conway , P. P. , 2006 , “ Thermal Interface Materials—A Review of the State of the Art ,” First Electronic System Integration Technology Conference...

...; published online January 24, 2014. Assoc. Editor: Masaru Ishizuka. 15 08 2013 25 12 2013 Thermal grease, as a thermal interface material (TIM), has been extensively applied in electronic packaging areas. Generally, thermal greases consist of highly thermally conductive solid fillers...

...Xi Liu; Jiantao Zheng; Suresh K. Sitaraman The thermal efficacy of thermal interface material (TIM) is highly dependent on its ability to adhere to the surfaces of interest. Any delamination of the TIM from the die or the lid will increase the local thermal resistance and, thus, will reduce...

...Jong-Jin Park; Minoru Taya A thermal interface material (TIM) is a crucial material for transferring heat from a die to a heatsink. We developed a new TIM composed of carbon nanotubes, silicon thermal grease, and chloroform. The thermal impedance of the TIM was measured using a new device based...